NANOCOM

Month: January 2026

TechConnect World 2026

NanoCom is proud to join global innovators at TechConnect World 2026, debuting a new class of electromagnetic simulation technology designed for the next generation of materials, electronics, and high-performance engineering. As systems push into higher frequency bands and tighter integration, simulation accuracy is no longer…
January 14, 2026
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Composite materials with engineered electromagnetic properties

Driving Innovation in Technology and Society Advanced electromagnetic composites—from magnetic and dielectric metamaterials to nanostructured media—are enabling breakthroughs that touch everyday life. They make wireless communication faster and more reliable, sensors more sensitive, antennas smaller and more efficient, and electronic devices safer and more energy-efficient.…
January 9, 2026
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From DC to mmWave on real boards

Designing printed circuit boards (PCBs) that perform reliably from DC to mmWave is increasingly critical in modern electronics, from high-speed computing and 5G networks to medical devices and autonomous vehicles. Traditional design approaches often rely on simplified circuit models or narrowband approximations, which can miss…
January 9, 2026
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Accelerate next-generation wireless design

Wireless systems are evolving at an unprecedented pace—from sub-6 GHz to mmWave and beyond—driven by tighter integration, wider bandwidths, and increasingly complex electromagnetic environments. Meeting these demands requires simulation technology that captures real-world physics without slowing innovation. Time-domain, full-wave electromagnetic simulation enables engineers to analyze…
January 1, 2026
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