High-Power Transmission Lines

Modern high-power transmission lines—whether on multilayer PCBs, power backplanes, coaxial feeds, or custom interconnects—operate in regimes where simple circuit assumptions break down. Fast signal transitions, high voltages, strong currents, and complex geometries create electromagnetic effects that must be captured accurately to ensure performance, reliability, and safety.

Our simulation technology bridges distributed electromagnetic field modeling with telegrapher-type transmission line formulations, enabling engineers to analyze real transmission structures with both physical fidelity and computational efficiency.

Unified Field and Transmission Line Modeling

Transmission lines are fundamentally electromagnetic structures. While telegrapher equations provide an efficient one-dimensional description of voltage and current propagation, their parameters and boundary conditions are governed by the surrounding fields and geometry.

Our approach combines full-wave field resolution in and around PCB traces, planes, vias, connectors, and dielectric stacks with distributed transmission line representations for long or repeated interconnects. Voltages, currents, and electromagnetic fields are coupled in an energy-consistent manner, allowing real structures to be modeled without relying on idealized assumptions.

This unified framework enables engineers to capture both localized electromagnetic effects and system-level transmission behavior within a single simulation environment.

Fast Time-Domain Simulation with Broadband Insight

High-power systems are often driven by fast transients such as switching edges, pulsed power events, and broadband excitations. These phenomena are naturally captured in the time domain, where wave propagation, reflections, ringing, and impedance discontinuities can be observed directly as they evolve.

Electromagnetic fields and transmission line quantities are advanced together in time, allowing engineers to evaluate peak voltages, currents, and field intensities throughout complex PCB and interconnect structures. From a single transient simulation, results can be transformed into the frequency domain, providing broadband impedance characteristics, spectral content, and transfer behavior without repeated narrowband analyses.

This approach gives engineers the practical insight needed to design, validate, and optimize high-power transmission lines with confidence, while maintaining the computational efficiency required for commercial engineering workflows.